Wallchip 团队主导设计的部分案列
Process: HL28HKC+
Package: FCBGA
Post-shrink(/0.9) die size with seal ring= 11399.4um*19391.4um
Seal ring post-shrink = 21.6um per edge
incetance ：33M
Die Area=221.050 mm^2
Clock frequency: 1600MHz@TT_1p05_85C5%
Process: HL28HKC+
Package: FCBGA
Post-shrink(/0.9) die size with seal ring= 11399.4um*19391.4um
Seal ring post-shrink = 21.6um per edge
incetance ：33M
Die Area=221.050 mm^2
Clock frequency: 1600MHz@TT_1p05_85C5%
联系电话